<--- Back to Details
First PageDocument Content
Łódź / Israel / Jewish culture / Uziel / Agriculture / Kibbutz
Date: 2015-01-14 10:00:05
Łódź
Israel
Jewish culture
Uziel
Agriculture
Kibbutz

RG[removed]0090_tcn_en.doc

Add to Reading List

Source URL: collections.ushmm.org

Download Document from Source Website

File Size: 561,72 KB

Share Document on Facebook

Similar Documents

Bevacizumab / Ovarian cancer / Gynecologic Oncology Group / Gynecologic oncology / Endometrial cancer / Sunitinib / Primary peritoneal carcinoma / Medicine / Oncology / Gynaecological cancer

Late-Breaking Abstracts 2015 Society of Gynecologic Oncology Annual Meeting on Women’s Cancer® Opening Scientific Session Saturday, March 28, 2015 Moderators: Uziel Beller, MD, Shaare Zedek Medical Center, Jerusalem,

DocID: 19cAx - View Document

Culture / Internet culture / Neologisms / Information retrieval / Social software / Social networking service / Similarity / Collaborative filtering / Social bookmarking / Social information processing / Collaboration / Information society

Same Places, Same Things, Same People? Mining User Similarity on Social Media Ido Guy, Michal Jacovi, Adam Perer, Inbal Ronen, Erel Uziel IBM Haifa Research Lab Mt. Carmel, Haifa 31905, Israel {ido, jacovi, adamp, inbal,

DocID: 10E9R - View Document

Electroplating / Copper / Plating / Sulfuric acid / Electrochemistry / Chemistry / Sulfates / Coatings

A NOVEL ELECTROLYTE COMPOSITION FOR COPPER PLATING IN WAFER METALLIZATION Uziel Landau Dept. of Chemical Eng., Case Western Reserve University, Cleveland, OH 44106

DocID: 106lG - View Document

Coatings / Electronics manufacturing / Semiconductor device fabrication / Electrical engineering / Copper interconnect / Plating / Electroplating / Copper plating / Wafer / Electromagnetism / Electronics / Electronic engineering

COPPER METALLIZATION OF SEMICONDUCTOR INTERCONNECTS – -- ISSUES AND PROSPECTS Uziel Landau Chemical Engineering Department and The Yeager Center for Electrochemical Sciences

DocID: 106lm - View Document

Plating / Electrical resistance and conductance / Physics / Technology / Measurement / Shunt / electrical engineering / Wafer

Contact Resistance in Copper Plating of Wafers – Analysis and Design Criteria Yezdi Dordia, Uziel Landaub, Jayant Lakshmikanthana, Joe Stevensa, Peter Heya and Andrew Lipinc a

DocID: Z7oE - View Document