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#	Item
261	________________________________________________________________________ DATE: 9th January, 2015 PCN #: 2169 PCN Title: Lead Frame Structure, Mold Compound and Solder Type changes to enhance PowerDI-5 package Add to Reading List Source URL: diodes.com Language: English - Date: 2015-01-09 11:36:06 Technology Electronics Electromagnetism Light-emitting diodes Diode PCN
262	Simple dummy firebox Not needed for closed cab loco backhead 1.5mm brass Cladding 0.5mm brass sheet, trim length to fit and soft solder to backhead. Ø6.5 Add to Reading List Source URL: www.16mm.org.uk - Date: 2012-07-06 11:09:10
263	Microsoft Word - Minerals Thematic and Fact Sheets - Fact Sheets - Tin - Formatted.DOCX Add to Reading List Source URL: www.mineralscouncil.com.au Language: English - Date: 2013-05-30 01:09:34 Periodic table Tin mining Tin Electrical conductors Transition metals Bronze Cassiterite Solder Copper Matter Chemistry Chemical elements
264	Microsoft Wordrevised Add to Reading List Source URL: rs.ieee.org Language: English - Date: 2011-06-08 19:43:14 Electronic engineering Ball grid array Solder Restriction of Hazardous Substances Directive Whisker Wave soldering Rework Flip chip Integrated circuit packaging Electronics manufacturing Electronics Chemistry
265	Hardware and Consumables \| Reece HVAC-R Add to Reading List Source URL: www.reece.com.au Language: English - Date: 2014-06-19 01:19:19 Chemistry Sealant Soldering Bostik Duct tape Silicone Caulking Seal Solder Adhesives Manufacturing Technology
266	Heemskirk Tin Project - Tasmania CEO Peter Blight The Tin Story and Beyond One2One Investor Forum September 19, 2012 Today’s Presentation Add to Reading List Source URL: www.proactiveinvestors.com.au Language: English - Date: 2012-09-19 19:28:03 Periodic table Solder London Metal Exchange Titanium nitride Matter Chemistry Tin
267	PDF Document Add to Reading List Source URL: www.isystem.com Language: English - Date: 2015-02-06 09:36:52 Electromagnetism Soldering Solder Surface-mount technology Quad Flat Package Lead Selective soldering Bead probe technology Electronics manufacturing Electronics Manufacturing
268	3/8" 3/16" 5/16" x 40 me 3/8" Add to Reading List Source URL: www.16mm.org.uk Language: English - Date: 2010-05-01 01:31:01 Solder Defense Intelligence Agency Stainless steel Software Dia Brass
269	TECHNICAL REPORTS Packaging Technologies for HighTemperature Power Semiconductor Modules Authors: Yasunari Hino, Nobuo Yokomura* and Hiroaki Tatsumi* 1. Introduction Add to Reading List Source URL: www.mitsubishielectric.com Language: English - Date: 2015-03-22 21:29:16** Manufacturing Semiconductor device fabrication Nanomaterials Semiconductors Electronic design Solder Sintering Nanoparticle Reliability Technology Metalworking Electronic engineering
270	Investor Presentation Q4-2014 Add to Reading List Source URL: www.besi.com Language: English - Date: 2015-03-02 04:26:15 Semiconductor device fabrication Materials science Chemistry Flip chip Solder IDMS

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