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MBPCB – HIGH-PERFORMANCE SUBSTRATE TECHNOLOGY MAIN FEATURES • 20% reduction in substrate thermal resistance over leading Aluminium-backed PCB materials • High composite thermal conductivity of 115 W/mK • Dielectr
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Document Date: 2013-04-25 13:39:48
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MBPCB – HIGH-PERFORMANCE SUBSTRATE TECHNOLOGY MAIN FEATURES • 20% reduction in substrate thermal resistance over leading Aluminium-backed PCB materials • High composite thermal conductivity of 115 W/mK • Dielectr