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Date: 2010-05-31 11:57:10 Manufacturing Quad-flat no-leads package Surface-mount technology Ball grid array Rework Solder Restriction of Hazardous Substances Directive Reflow soldering Printed circuit board Electronics manufacturing Electronics Electromagnetism		Microsoft Word - AN-1133_Rev_C.doc Add to Reading List Source URL: www.irf.com Download Document from Source Website File Size: 841,59 KB Share Document on Facebook

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