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Hermetic Wafer-Level Packaging development for RF MEMS switch C. Ferrandon1*, F. Greco1, E. Lagoutte1, P. Descours1, G. Enyedy1, M. Pellat1, C. Gillot1, P. Rey1, D. Mercier1, M. Cueff1, X. Baillin1, F. Perruchot1, N. Sil
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Document Date: 2011-12-19 03:46:29


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City

F38054 Grenoble / Tempe / /

Company

France 2Freescale Semiconductor / /

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ProgrammingLanguage

DC / /

ProvinceOrState

Arizona / /

Technology

MEMS / dielectric / /