Back to Results
First PageMeta Content
Semiconductor device fabrication / Copper interconnect / Chemical-mechanical planarization / Plating / GlobalFoundries / Wafer / Back end of line / Fraunhofer Society / Copper plating / Silicon Saxony


FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICES
Add to Reading List

Document Date: 2016-04-01 03:01:20


Open Document

File Size: 867,79 KB

Share Result on Facebook