| Document Date: 2015-04-23 11:15:59
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Company IBM / TARGET / ADP / Synopsys Inc. / StarRC Solution Semiconductor / / Country United States / / Facility interchange StarRC / / IndustryTerm process technologies / design solutions / adoption chemical-mechanical polishing / designers extraction tools / signoff tools / variation-aware process technology file / signoff tool / extraction technology / parasitic extraction solution / large routing metal / grid computing management software analysis / physical verification solution / extraction tool / hardware network / metal fill post gold standard accuracy / sub-femtoFaradaccurate technology / multicore processing / mixed-signal implementation solution / metal layers / multicore technology / nanometer process technologies / Metal extraction / metal fill / metal / technology nodes / extraction solution / adjacent metal / process technology / implementation systems / stacked die technologies / design process technology files / finer metal pitch / field solver technology / technology node / clock networks / metal lines / processor hardware / performing 3D server / physical implementation solution / non-uniform metal density / / OperatingSystem SUSE / AIX / Solaris / / Organization ASIC / / / Position Leader / conductor / designer / leading CustomSim circuit simulator Designer / local sales representative / accurate and efficient Designer / / Product Compiler physical implementation solution / Compiler / / Technology semiconductor / stacked die technologies / embedded Rapid3D technology / re-insertion Rapid3D technology / field solver technology / process technology / CMP / nanometer process technologies / sub-femtoFaradaccurate technology / Rapid3D technology / ASIC / multicore technology / dielectric / process technologies / silicon interposer 3D-IC technologies / simulation / extraction technology / / URL www.synopsys.com / http /
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Datasheet StarRC Parasitic extraction Overview