CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and Modeling - Nusselt number - Document - PDFSEARCH.IO

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	CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and Modeling Add to Reading List Document Date: 2013-05-28 16:20:41 Open Document File Size: 2,67 MB Share Result on Facebook City Zurich / / Company 3D / IBM / B. Michel 1 Laboratory / Fluid Flow (submitted for publication 2013) Laboratory / / Country Switzerland / / Facility Laboratory of Thermodynamics / / IndustryTerm electronics / electronic chips / / Organization Department of Mechanical and Process Engineering / / Person Steady b / / Position representative / / Technology thermal performances Chip / laser / Heat transfer / Thermodynamics / 3D chip / Microfluidics / temperature visualization Chip / / URL www.ltnt.ethz.ch / / SocialTag Heat transfer Passive fire protection Heat conduction Water pollution Heat sink Thermal management of electronic devices and systems Nusselt number Microfluidics Water cooling Mechanical engineering

CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and ModelingAdd to Reading List