IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 1, JANUARYA Modular 1 mm Die-Stacked Sensing Platform With Low Power I C Inter-Die Communication and - IEEE Power - Document - PDFSEARCH.IO

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	IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 1, JANUARYA Modular 1 mm Die-Stacked Sensing Platform With Low Power I C Inter-Die Communication and Add to Reading List Document Date: 2018-02-09 11:31:56 Open Document File Size: 3,47 MB Share Result on Facebook

IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 1, JANUARYA Modular 1 mm Die-Stacked Sensing Platform With Low Power I C Inter-Die Communication andAdd to Reading List