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Radio electronics / Radar / Wireless / Antenna / Phased array / Integrated circuit / Microwave / RF MEMS / Fresnel zone antenna / Telecommunications engineering / Technology / Electronic engineering


1806 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 1, NO. 11, NOVEMBER 2011 Organic Packages with Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets
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Document Date: 2012-12-31 09:40:31

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Gainesville / Anaheim / Hsinchu / Albuquerque / Suwon / Piqua / Xi’an / Chennai / Pasadena / New York / Daejeon / Sunnyvale / /

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Silicon Image / Analog Devices Outstanding Student IC / Semiconductor Research Corporation / McGraw-Hill / Valor Enterprises Inc. / IEEE T RANSACTIONS / MediaTek / IBM / IEEE Journal / /

Country

Korea / China / India / Taiwan / United States / /

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USD / pence / /

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Facility

Stanford University / University of Florida / Indian Institute of Technology / Korea Advanced Institute of Science / North Carolina State University / Ohio State University / California Institute of Technology / Ajou University / XiDian University / /

IndustryTerm

microwave flip-chip applications / early manufacturing results / computer-aided design tool / devised cooling solution / Wireless Chipsets Dong Gun Kam / communications technologies / stencil printing eutectic solder cap / wireless chipsets / wireless link / energy coming / antenna-in-package solutions / wireless communications / flip-chip technology / embedded air cavities poses manufacturing challenges / metal layers / antenna systems / metal / receiver chip / controlled collapse chip / millimeter-wave applications / flip-chip / manufacturing / high-data-rate wireless links / devised packaging solution / lower cost packaging technology / wireless communication / broadband communications / millimeter-wave devices / wireless docking / tested chip / chip-scale packaging technology / metal strips / fixed-beam solutions / antenna-in-package solution / Potential large-volume applications / wireless transceivers / amplitude modulation single-carrier / wireless transceiver circuits / subsequent surface mount device / mainstream manufacturing / package manufacturing tolerance / metal pattern / manufacturing tolerance / cavity manufacturing flow / package solutions / wireless video links / digital signal processing / /

Organization

Technical Program Committee for the International Symposium / DARPA Young Faculty / US Federal Reserve / Indian Institute of Technology / California Institute of Technology / Technical Program Committee for the International SolidState Circuits Conference and the Steering / Korea Advanced Institute of Science and Technology / XiDian University / Department of Electrical and Computer Engineering / North Carolina State University / Raleigh / Stanford University / Ohio State University / Columbus / Ajou University / University of Florida / Technical Advisory Board / /

Person

Brian A. Floyd / Duixian Liu / Scott K. Reynolds / Arun Natarajan / Horn Antenna Fixture / Dong Gun Kam / /

Position

Designer / Post-Doctoral Researcher / Associate Professor / Editor / Electrical Engineer / Chief Engineer / Manager of the Millimeter-Wave Circuits and Systems Group / Assistant Professor / Member Research Staff / /

Product

Koss P15 Headphone/Headset / TIM injection / M-16 / Heat sink DC Motor BGA Board TIM injection / /

ProgrammingLanguage

DC / /

ProvinceOrState

Ohio / New York / New Mexico / California / Florida / /

PublishedMedium

the IEEE Journal / /

RadioStation

Radio Freq / /

SportsLeague

Stanford University / /

TVStation

WPAN / /

Technology

radiation / controlled collapse chip / 3-D / communications technologies / amplitude modulation / integrated circuits / chip-scale packaging technology / lower cost packaging technology / frequency division multiplexing / HDTV / broadband / receiver chip / wireless communications / disk drive / microwave / 60-GHz technology / SiGe technologies / RF chip / laser / dielectric / radio frequency / flip-chip technology / simulation / Digital Object Identifier / flip-chip BGA technology / /

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