Ultra-Thin, Flexible Ceramic Substrate Opens Path to Smaller, Lighter Products Solid State Devices: No outgassing in vacuum chamber Higher temperature film depositions - Flexible path - Document - PDFSEARCH.IO

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	Ultra-Thin, Flexible Ceramic Substrate Opens Path to Smaller, Lighter Products Solid State Devices: No outgassing in vacuum chamber Higher temperature film depositions Add to Reading List Document Date: 2016-04-14 21:46:30 Open Document File Size: 799,95 KB Share Result on Facebook

Ultra-Thin, Flexible Ceramic Substrate Opens Path to Smaller, Lighter Products Solid State Devices: No outgassing in vacuum chamber Higher temperature film depositionsAdd to Reading List