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|---|---|---|
 Date: 2015-01-15 16:05:10Technology Deep reactive-ion etching Microelectromechanical systems Etching Wafer Applied Materials Thermal oxidation Back end of line Photoresist Semiconductor device fabrication Materials science Microtechnology |
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3D INTEGRATION: TSV PROCESSES AND WAFER THINNING 1 | FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICESDocID: 1pmt2 - View Document |
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