Crack propagation and fracture in silicon wafers under thermal stress

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Date: 2014-04-05 17:08:04 Solid mechanics Deformation Plasticity Fracture Dislocation Ductility Brittleness Crack Strength of materials Mechanics Materials science Physics		Crack propagation and fracture in silicon wafers under thermal stress Add to Reading List Source URL: journals.iucr.org Download Document from Source Website File Size: 571,88 KB Share Document on Facebook

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