Back to Results
First PageMeta Content
Technology / Capacitive Micromachined Ultrasonic Transducers / Microelectromechanical systems / Etching / Plasma-enhanced chemical vapor deposition / Chemical vapor deposition / Polycrystalline silicon / Strain engineering / Chemical-mechanical planarization / Semiconductor device fabrication / Materials science / Chemistry


Document Date: 2008-12-29 17:55:23

Open Document

File Size: 1,69 MB

Share Result on Facebook

City

Diyarbakir / Canonsburg / Cookeville / Norwood / Sunnyvale / A MEMS / St. Petersburg / Woodbury / /

Company

ANSYS Inc. / Veeco Instruments / Analog Devices / RCA / G. G. Yaralioglu A. S. / IEEE Sensors Journal / Y. Huang A. S. / Interdigital / Unaxis Semiconductors / E.L. Ginzton Laboratory / ONDA Corp. / C. H. Cheng A. S. / /

Continent

America / /

Country

Turkey / United States / /

Currency

CHF / USD / /

/

Facility

Middle East Technical University / Bilkent University / E.L. Ginzton Laboratory of Stanford University / Stanford University / Georgia Institute of Technology / N. A. Hall / Louisiana State University / building CMUT / Tennessee Technological University / /

IndustryTerm

metal layer acts / specific applications / metal sacrificial layer / metal traces / patterned metal-bottom electrode / wafer-bonding technology / sputtered metal / intravascular imaging arrays / microfluidic applications / photolithograpy equipment / array applications / receiver electronics / intravascular ultrasound imaging / digital mirror devices / ip-chip / maximum processing temperature / particular device / forward looking intravascular ultrasound imaging / electronics integration / metal sputtering system / imaging / chemical-mechanical polishing / intravascular ultrasound imaging applications / real estate / metal / typical device / chemical vapor / metal layer / forward-looking imaging / immersion applications / post-complementary metal oxide semiconductor / identical devices / metal-bottom electrode / maximum processing temperature chip / chemical-vapor deposition / acoustic and opto-acoustic devices / metal oxide semiconductor / electronics / patterned metal bottom electrode / metal sacrificial layers / low-pressure chemical vapor depositions / distinct applications / /

Organization

National Science Foundation / Tennessee Technological University / Whitaker Foundation / School of Mechanical Engineering / Stanford University / Louisiana State University / Technical Program Committee of the IEEE Ultrasonics Symposium / Georgia Institute of Technology / Atlanta / Middle East Technical University / Ankara / Bilkent University / Ankara / /

Person

Joshua Knight / F. Levent Degertekin / W. D. Nix / Ion Etch / L. Visigalli / V / /

Position

Research Associate / Assistant Professor / associate editor / /

ProgrammingLanguage

FL / DC / /

ProvinceOrState

Tennessee / Florida / California / Georgia / /

PublishedMedium

the IEEE Sensors Journal / /

SportsLeague

Stanford University / /

Technology

semiconductor / ultrasound / CMOS technology / MEMS / wafer-bonding technology / Dielectric / radio frequency / simulation / maximum processing temperature chip / /

SocialTag