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Chemistry / Thin film deposition / Microtechnology / Coatings / Plasma processing / Chemical vapor deposition / Atomic layer deposition / Applied Materials / Thin film / Semiconductor device fabrication / Materials science / Technology


Document Date: 2012-12-05 16:42:34

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Company

FILER APPLIED MATERIALS INC / Varian Semiconductor Equipment Associates Inc. / Dielectric Films / Gap Fill Films / Business Incorporated / Applied Materials Inc. / Celera / Strain Engineering Solutions / Applied Global Services / Lithography-Enabling Solutions / The NASDAQ Stock Market LLC Securities / The Silicon Systems Group / Contents Through-Silicon Via Films / /

Currency

USD / /

Event

Product Release / General or Shareholder Meeting / M&A / /

Facility

Mine Safety Disclosures / /

IndustryTerm

metal gate transistors / metallization technologies / chemical fluid / 22nm technology node / metal deposition system / offers several technologies / end products / manufacturing systems / chemical vapor deposition / metal atoms / metal deposition processes / metal layers / simultaneous processing capacity / manufacturing process / high-k/metal gates / metal / gate stack tool / offers systems / systems / metal target / multi-chamber product / epitaxial deposition technologies / electronic devices / manufacturing cycle / chemical mechanical planarization / energy efficiency / manufacturing / 300mm systems / metal films / integrated circuit device / high productivity manufacturing / latter product / rapid thermal processing / epi technology / greater computing capability / process technology areas / earlier-generation 200mm systems / conformal plasma doping technology / 193nm lithography tools / integrated circuit devices / manufacturing methods / semiconductor manufacturing systems / ion implantation equipment / corporate Web site / solar module manufacturing / back-end applications / fabrication equipment / metal film layers / semiconductor equipment products / metal materials / power-efficient devices / consumer products / production-proven systems / manufacturing steps / manufacturing equipment / semiconductor wafers and chips / multi-chamber systems / semiconductor chips / cure solution / /

Organization

UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington / D.C. / Securities and Exchange Commission / Internal Revenue Service / I.R.S. / /

Person

Nanocure / /

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Position

Producer / Director Independence Principal Accounting Fees and Services / Applied Producer / /

Product

Endura platform / Endura system / 193nm lithography tools / Centura / Producer Optiva™ CVD system / Producer / Endura Amber™ PVD system / Endura Amber™ PVD / Producer Optiva™ CVD / Endura / 193nm / /

ProgrammingLanguage

Onyx / /

ProvinceOrState

Incorp. /

Technology

RTP technologies / CuBS technology / copper-based chips / ALD technology / HTML / photolithography / ECD technologies / integrated circuits / chemical vapor deposition / CMP / Epi technology / semiconductor chips / conformal plasma doping technology / copper-based chip / epitaxial deposition technologies / semiconductor / Using PVD technology / CVD system / epitaxial silicon / a wide range of manufacturing equipment / lithography / process control / smartphones / metallization technologies / rapid thermal processing / SiGe epi technology / CVD / integrated circuit / /

URL

www.secdatabase.com / /

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