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Microtechnology / Technology / Plasma processing / Nanotechnology / Thin film deposition / Microelectromechanical systems / Etching / Chemical vapor deposition / Surface micromachining / Materials science / Chemistry / Semiconductor device fabrication


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City

Palo Alto / /

Company

General Electric / difluoride HF / Union Carbide / Agilent Laboratories / SI / Agilent Technologies / Cu Ag / Ge / Vanadium / 3M / Corning / /

Country

United States / /

Currency

USD / /

/

Facility

University of California at Berkeley / /

IndustryTerm

carrier gas / metal / plasma-enhanced chemical-vapor-deposition sccm / chemical-vapor-deposition / metal layer / chemical-vapor-deposited oxides / electronics industry / electronics / microelectromechanical systems / high-temperature processing / materials processing / difficult metal / silicon-wafer processing steps / low-pressure chemical-vapor deposisccm / /

Organization

University of California / African Union / Berkeley Sensor & Actuator Center / /

Person

Al O . Pyrex / A. J. Ricco / Ion Milled / /

Position

author / excellent electrical conductor / CPA / private consultant / Subject Editor / /

ProvinceOrState

California / /

Technology

MICROELECTROMECHANICAL SYSTEMS / MEMS / ATM / fuel cells / Digital Object Identifier / integrated circuits / CVD / Chemical vapor deposition / /

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