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Electronic engineering / Electromagnetism / Integrated circuits / Electronics / Semiconductor devices / Semiconductor device fabrication / Electronics manufacturing / Survival analysis / Three-dimensional integrated circuit / Through-silicon via / Embedded instrumentation / Built-in self-test


TSV BIST™: An Innovative Method for 2.5D/3D IC Interconnection Integrity Monitoring Hans Manhaeve, Ph.D. Ridgetop Europe, n.v. L. Bauwensstraat 20, B-8200 Brugge, Belgium
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Document Date: 2015-07-18 01:30:08

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File Size: 352,55 KB

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